ADVENTURECluster User Meeting 2023 AfterReport
Wed., October 11, 2023
"ADVENTURECluster User Meeting 2023" was held cooperatively (jointly) by Allied Engineering Co., Ltd. and SCSK Co., Ltd. This time, for the first time in four years, the seminar was held face-to-face at the venue. This year's 15th Users Meeting featured a keynote speech by Yokohama Rubber, and presentations by Honda Motor, Toyama Prefectural University, Toyota Motor, and Mazda (in the order of company name presentation). The presentation also included the latest topics from SCSK Co., Ltd and the announcement of the latest version from the developer, Allied Engineering Co., Ltd.
Organizing | Organized by SCSK Co., Ltd Co-sponsored by Allied Engineering Co., Ltd. |
---|---|
Date & Time |
1. User meeting 10:30-15:45 (Reception time on the event day: 10:00-) 2. Unconference 16:05-17:05 3. Information exchange meeting (social gathering) 17:05-18:30 |
Venue | Tokyo Conference Center, Shinagawa |
Location | 3-5F Aarea Shinagawa, 1-9-36 Konan, Minato-ku, Tokyo 108-0075, Japan |
Expected visitors | 1. ADVENTURECluster users 2. Customers considering ADVENTURECluster |
Keynote Speech: “Challenges for Technological Innovation through Collaboration of Humans, AI and CAE"
Yokohama Rubber has been challenging technological innovation through “collaboration between humans and AI” by announcing an AI utilization concept called “HAICoLab” in 2020. The challenge of radical innovation (exploration) for discoveries in unexplored areas requires CAE technologies such as numerical simulation and evolutionary computation, in addition to people and AI. In this keynote speech, he introduced his thoughts on HAICoLab and its past successes and failures, and mentioned the future role and prospects of CAE. ・Mr. Masataka Koishi,
- The Yokohama Rubber Co., Ltd.
User Case Study Presentation ① “Prediction of Sealing Performance of Plastic Head Cover Considering Creep Deformation"
【Summary】
The presentation introduced a creep analysis case study of a plastic head cover of an engine. The space between the cylinder head and the head cover is sealed by a rubber gasket. In order to secure the collapse allowance of the rubber gasket, it is necessary to predict the amount of deformation of the plastic head cover after assembly.
The creep deformation of resin under operating conditions was predicted by ADVENTURECluster's creep option, and the accuracy was verified by comparison with actual measurements.
- ・Mr. Shuichi Tsurusaki, Honda Motor Co., Ltd.
User Case Study Presentation ② “Analysis Case Study on Strength Evaluation of Solder Joints and Human Body Structure"
【Summary】
It is said that the majority of defects in electronic equipments are caused by damage to the solder joints of electronic components. Temperature changes associated with turning electronic devices on and off cause thermal stress due to the mismatch in linear expansion coefficients between materials, resulting in the accumulation of damage in solder joints.He introduced an example of analysis for strength evaluation of solder joints using ADVENTURECluster. In addition, he also introduced the human body structure analysis and femur analysis technology as examples of new efforts in recent years.
- ・Assosiate professor Takahiro Kinoshita, Toyama Prefectural University
User Case Study Presentation ③ “Shortening CAE Study Time for Early Completion of Engine Component Design"
【Summary】
Cylinder heads and blocks, which are the frame parts of engines, require strength calculations using large-scale structural models due to their complex shapes and load configurations, and the large calculation time required is an obstacle to shortening the CAE study period. By utilizing ADVENTURECluster, a significant reduction in calculation time has been achieved. This has enabled the company to expand the scope of analysis and evaluation by further detailing large-scale structural models, and to shorten the CAE study period for cylinder head and block design.
- ・Mr. Ikuya Osumi, Toyota Motor Corporation
User Case Study Presentation ④ “Introduction of Large-Scale Topology Optimization Technology Development for ADVENTURECluster and Potential for Manufacturing Innovation"
【Summary】
In recent years, topology optimization technology has become a hot topic to realize the ideal of structural analysis that “automatic calculation of the shape of the structural component with the highest performance and the lightest weight". Although this is a wonderful technology, it has a major challenge in that it requires an enormous amount of computation time, up to several weeks, when the model size becomes large. To solve this problem, we are working to incorporate topology optimization technology into ADVENTURECluster, a large-scale structural analysis solver.
Mazda Motor Co. and Allied Engineering Co. have been working on the development of ADVENTURECluster's topology optimization technology for practical applications (high-speed calculation, non-yielding, non-destructive, etc.). The development of this technology has finally progressed to the practical stage, which is expected to revolutionize the product development process. We hope that users will consider and use this technology, and we would like to introduce it to you with examples of calculations.
- Mr. Shogo Sannomaru, Mazda Motor Corporation
Presentation by SCSK Co.
- ・Fatigue analysis methods, calculation methods, and examples of analysis were presented.
- ・ADVENTURECluster Builder introduced a useful function for generating meshes for complex shapes in a hassle-free and stable manner.
Presentation by Allied Engineering Co.
- ・An overview of the optimization function and examples of analysis were presented.
- ・Introduction of the latest version ADVENTURECluster2023 and future development policy were presented.
Unconference
Fifteen tables were set up for each theme, and users with the same issues gathered for free discussion. The lively exchange of opinions among the participants made the meeting very meaningful.
Information exchange meeting (social gathering)
A reception was held for attendees to meet and mingle with other attendees and the developer.