Case study of sub-model analysis of a mounted IC chip about thermal deformation of a multilayer printed circuit board
This analysis was performed for thermal deformation analysis of multilayer printed circuit boards and fatigue crack propagation analysis of solder joints. Multilayer printed circuit boards require a large number of meshes and a very long computation time, but ADVENTURECluster is able to perform calculations at high speed. In addition, in order to reduce calculation time, by using solid shell elements installed in ADVENTURECluster, the number of nodes is significantly reduced compared to conventional tetrahedral quadratic elements, making it possible to analyze at high speed. Although there is concern that reducing the number of mesh nodes may worsen the accuracy of the analysis. In this case, the solid shell element enables an analysis with the same accuracy as a conventional solid mesh, and the calculation time is 74 times faster.
Analysis overview
| Target | Multilayer printed circuit boards, IC chips |
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| Items | Thermal deformation analysis, Fatigue crack growth analysis |
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Background/Issues
In the manufacturing process of multilayer printed circuit boards, there are problems such as board warpage due to heat, mounting defects of electronic components, and breakage of solder joints.
The number of meshes increases with the lamination of thin plates, and conventional software cannot analyze the full model in a practical timeframe.
Analytical Needs
Heating during the reflow process causes warping of multilayer printed circuit boards, leading to poor mounting of electronic components and breakage of solder joints. We want to perform analysis that accurately reproduces wiring patterns without simplifying CAD.
Advantages
Multilayer printed circuit boards are a collection of thin plates with many wires and complex geometry, resulting in a huge number of meshes, which takes a long time to analyze. ADVENTURECluster is capable of high-speed calculations, so calculations can be performed within a practical time frame.
ADVENTURECluster includes the capability of solid shell elements, which are positioned between solid and shell meshes. By using solid shell elements, the number of contacts in the overall analysis can be reduced, allowing for even faster analysis.