Evaluation of mold strength considering the resin molding process
By using the standard mapping tool "collabo", the temperature and stress distributions obtained from the resin flow analysis software can be used as the boundary conditions for thermal stress analysis. This makes it possible to evaluate the strength of the mold, taking into account of the load that generated during the resin molding process. Because the model is made by large-scale solid element that ADVENTURECluster excels at, the calculation speed is fast.
Analysis overview
| Target | Resin mold |
|---|---|
| Items | Static analysis, heat transfer analysis, Collabo |
| No. of nodes/parts | 3,139,136 nodes / 36 parts |
| Computation time | 36 minutes: 4 cores/19,1GB 20 minutes: 8 cores/18.6GB |
|---|---|
| Coupled software | moldflow |
Background/Issues
The scale of the mold assembly model is large, so it takes a long time to calculate.
Analytical Needs
To analyze the strength of the resin mold, taking into account of the load placed on the mold during the molding process.
To use the amount of mold opening to predict burrs.
To identify the cause of the damage due to injection pressure.
Advantages
Using the ADVENTURECluster standard mapping tool "collabo", it is possible to easily map the thermal and pressure data of plastic injection molding software.
Mold assembly models can be calculated at high speed.